Author/Creator: Schneider-Ramelow, M. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Schneider-Ramelow, M.

1. Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics. (September 2018)

Authors:: Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M.
Journal:: Microelectronics and reliability
Issue:: Volume 88/90(2018)
Page Start:: 534
Record Type:: Journal Article
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2. Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding. Issue 9 (August 2015)

Authors:: Broll, M.S.; Geissler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.D.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 9/10(2015)
Page Start:: 1855
Record Type:: Journal Article
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3. Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding. (November 2022)

Authors:: Elsotohy, M.; Froehlich, J.; Dietrich, L.; Oppermann, H.; Schneider-Ramelow, M.
Journal:: Microelectronics and reliability
Issue:: Volume 138(2022)
Page Start:
Record Type:: Journal Article
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4. Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation. (November 2020)

Authors:: Kolbinger, E.; Kuttler, S.; Wagner, S.; Schneider-Ramelow, M.
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
Page Start:
Record Type:: Journal Article
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5. Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles. (November 2022)

Authors:: Hölck, O.; Vernhes, P.; Gamba, B.; Cruz, R.; Huber, S.; Braun, T.; Schneider-Ramelow, M.
Journal:: Microelectronics and reliability
Issue:: Volume 138(2022)
Page Start:
Record Type:: Journal Article
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