1. Simulating the warping of thin coated Si wafers using Ansys layered shell elements. (15th April 2016) Authors: Schicker, J.; Khan, W.A.; Arnold, T.; Hirschl, C. Journal: Composite structures Issue: Volume 140(2016) Page Start: 668 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Simulating the warping of thin coated Si wafers using Ansys layered shell elements. (15th April 2016) Authors: Schicker, J.; Khan, W.A.; Arnold, T.; Hirschl, C. Journal: Composite structures Issue: Volume 140(2016) Page Start: 668 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗