1. 3D Microstructure Characterization of a Silicon Based Anode Material on Different Length Scales suitable for Storage Applications. (August 2019) Authors: Vorauer, T.; Kumar, P.; Chamasemani, F. F.; Rosc, J.; Fuchsbichler, B.; Koller, S.; Helfen, L.; Jouneau, P.H.; Lyonnard, S.; Brunner, R. Journal: Microscopy and microanalysis Issue: Volume 25:(2022)Supplement 2 Page Start: 356 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Advanced 3D failure characterization in multi-layered PCBs. (December 2016) Authors: Grünwald, E.; Hammer, R.; Rosc, J.; Maier, G.A.; Bärnthaler, M.; Cordill, M.J.; Brand, S.; Nuster, R.; Krivec, T.; Brunner, R. Journal: NDT & E international Issue: Volume 84(2016) Page Start: 99 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Advanced 3D failure characterization in multi-layered PCBs. (December 2016) Authors: Grünwald, E.; Hammer, R.; Rosc, J.; Maier, G.A.; Bärnthaler, M.; Cordill, M.J.; Brand, S.; Nuster, R.; Krivec, T.; Brunner, R. Journal: NDT & E international Issue: Volume 84(2016) Page Start: 99 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy. (September 2016) Authors: Grünwald, E.; Rosc, J.; Hammer, R.; Czurratis, P.; Koch, M.; Kraft, J.; Schrank, F.; Brunner, R. Journal: Microelectronics and reliability Issue: Volume 64(2016) Page Start: 370 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy. (September 2016) Authors: Grünwald, E.; Rosc, J.; Hammer, R.; Czurratis, P.; Koch, M.; Kraft, J.; Schrank, F.; Brunner, R. Journal: Microelectronics and reliability Issue: Volume 64(2016) Page Start: 370 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Parameter driven monitoring for a flip-chip LED module under power cycling condition. (March 2018) Authors: Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E. Journal: Microelectronics and reliability Issue: Volume 82(2018) Page Start: 84 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Prediction of porosity characteristics of aluminium castings based on X-ray CT measurements. (3rd September 2018) Authors: Weidt, M.; Hardin, R. A.; Garb, C.; Rosc, J.; Brunner, R.; Beckermann, C. Journal: International journal of cast metals research Issue: Volume 31:Number 5(2018) Page Start: 289 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. (September 2017) Authors: Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E. Journal: Microelectronics and reliability Issue: Volume 76/77(2017) Page Start: 601 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. X-ray computed tomography for fast and non-destructive multiple pearl inspection. (November 2016) Authors: Rosc, J.; Hammer, V.M.F.; Brunner, R. Journal: Case studies in nondestructive testing and evaluation Issue: Volume 6: Part A(2016:Oct.) Page Start: 32 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗