1. A new cure kinetics model to simulate thermomechanical behavior of polymeric sealants for automotive applications. (16th December 2021) Authors: Choi, Jae-Hyuk; Shim, Wonbo; Rhie, Chul Hong; Yu, Woong-Ryeol Journal: Functional composites and structures Issue: Volume 3:Number 4(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗