Author/Creator: Ren, Boqiao - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Ren, Boqiao

1. Effect of porous Cu addition on the microstructure and properties of Sn58Bi solder joints. (25th September 2019)

Authors:: Liu, Yang; Ren, Boqiao; Xu, Ruisheng; Zhang, Hao; Sun, Fenglian
Journal:: Materials research express
Issue:: Volume 6:Number 11(2019)
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Record Type:: Journal Article
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2. Improvement on the mechanical properties of eutectic Sn58Bi alloy with porous Cu addition during isothermal aging. (12th July 2021)

Authors:: Liu, Yang; Ren, Boqiao; Xue, Yuxiong; Zhou, Min; Cao, Rongxing; Zeng, Xianghua
Journal:: Materials research express
Issue:: Volume 8:Number 7(2021)
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Record Type:: Journal Article
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3. Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging. (December 2021)

Authors:: Liu, Yang; Ren, Boqiao; Xue, Yuxiong; Zhou, Min; Cao, Rongxing; Chen, Penghui; Zeng, Xianghua
Journal:: Microelectronics and reliability
Issue:: Volume 127(2021)
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Record Type:: Journal Article
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