1. Investigating thiol-epoxy composites for semiconductor die attach adhesives. Issue 1718 (2015) Authors: Wei, Andrew; Reit, Radu; Voit, Walter Editors: Lendlein, A.; Tirelli, N.; Weiss, R.A.; Xie, T. Journal: MRS proceedings Issue: Issue 1718:(2014) Page Start: 27 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗