1. Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints. (19th April 2021) Authors: Xinmeng, Zhai; Yue, Chen; Li, Yuefeng; Jun, Zou; Mingming, Shi; Bobo, Yang; Yang, Li; Chunfeng, Guo; Rongrong, Hu; Qinglou, Cao Journal: ECS journal of solid state science and technology Issue: Volume 10:Number 4(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗