Author/Creator: Pollard, Scott - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Pollard, Scott

1. 68‐4: Demonstration of the Novel Ultra‐Slim Flexible Glass as Substrate with Metal Meshed Antenna. Issue 1 (May 2016)

Authors:: Tseng, Chia-Ying; Chen, Yi-Jiun; Wang, Kai-Jiun; Lin, Jen-Chieh; Garner, Sean; Pollard, Scott; Kuo, Kuan-Ting; Chang, Kao-Der; Lin, Hung-Yi; Wang, Yu-Ming; Lin, Hoang Yan
Journal:: Digest of technical papers
Issue:: Volume 47:Issue 1(2016)
Page Start:: 937
Record Type:: Journal Article
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2. Communication—Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass. Issue 1 (1st January 2019)

Authors:: Chang, Yiu-Hsiang; Tseng, Pei-Lien; Lin, Jen-Chieh; Chen, Jie-Chi; Huang, Meng-Chi; Lin, Hung-Yi; Pollard, Scott; Mazumder, Prantik
Journal:: Journal of the Electrochemical Society
Issue:: Volume 166:Issue 1(2019)
Page Start:: D3155
Record Type:: Journal Article
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3. Communication—Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass. Issue 1 (27th November 2018)

Authors:: Chang, Yiu-Hsiang; Tseng, Pei-Lien; Lin, Jen-Chieh; Chen, Jie-Chi; Huang, Meng-Chi; Lin, Hung-Yi; Pollard, Scott; Mazumder, Prantik
Journal:: Journal of the Electrochemical Society
Issue:: Volume 166:Issue 1(2019)
Page Start:: D3155
Record Type:: Journal Article
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4. Contexts Rather Than Close Readings of Latin American Literature. Issue 1 (19th March 2023)

Authors:: Pollard, Scott
Journal:: Latin American research review
Issue:: Volume 58:Issue 1(2023)
Page Start:: 226
Record Type:: Journal Article
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5. Evaluation of the helium hermeticity reliability of copper through-glass vias. (October 2022)

Authors:: Okoro, Chukwudi; Maurey, Pamela; Davis, Ronald; Pollard, Scott
Journal:: Microelectronics and reliability
Issue:: Volume 137(2022)
Page Start:
Record Type:: Journal Article
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6. In-situ temperature-dependent characterization of copper through glass via (TGV). (February 2022)

Authors:: Pan, Ke; Xu, Jiefeng; Lai, Yangyang; Park, Seungbae; Okoro, Chukwudi; Joshi, Dhananjay; Pollard, Scott
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
Page Start:
Record Type:: Journal Article
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7. The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study. Issue 2 (24th October 2020)

Authors:: Ahmed, Omar; Okoro, Chukwudi; Pollard, Scott; Jiang, Tengfei
Journal:: Multidiscipline modeling in materials and structures
Issue:: Volume 17:Issue 2(2021)
Page Start:: 451
Record Type:: Journal Article
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8. The interfacial reliability of through-glass vias for 2.5D integrated circuits. Issue 4 (3rd August 2020)

Authors:: Ahmed, Omar; Jalilvand, Golareh; Pollard, Scott; Okoro, Chukwudi; Jiang, Tengfei
Journal:: Microelectronics international
Issue:: Volume 37:Issue 4(2020)
Page Start:: 181
Record Type:: Journal Article
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9. Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates. (May 2021)

Authors:: Okoro, Chukwudi; Jayaraman, Shrisudersan; Pollard, Scott
Journal:: Microelectronics and reliability
Issue:: Volume 120(2021)
Page Start:
Record Type:: Journal Article
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