Author/Creator: Phommahaxay, Alain - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Phommahaxay, Alain

1. Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding. (8th September 2020)

Authors:: Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric
Journal:: ECS transactions
Issue:: Volume 98:Number 4(2020)
Page Start:: 21
Record Type:: Journal Article
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2. Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding. (19th June 2019)

Authors:: Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric
Journal:: ECS journal of solid state science and technology
Issue:: Volume 8:Number 6(6019)
Page Start:: P346
Record Type:: Journal Article
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3. Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding. (1st January 2019)

Authors:: Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric
Journal:: ECS journal of solid state science and technology
Issue:: Volume 8:Number 6(6019)
Page Start:: P346
Record Type:: Journal Article
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4. Influence of Composition of SiCN Film for Surface Activated Bonding. (20th July 2018)

Authors:: Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Visker, Jakob; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyne, Eric
Journal:: ECS transactions
Issue:: Volume 86:Number 5(2018)
Page Start:: 159
Record Type:: Journal Article
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5. Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer. (October 2020)

Authors:: Inoue, Fumihiro; Podpod, Arnita; Peng, Lan; Phommahaxay, Alain; Rebibis, Kenneth June; Uedono, Akira; Beyne, Eric
Journal:: Journal of manufacturing processes
Issue:: Volume 58(2020)
Page Start:: 811
Record Type:: Journal Article
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