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Author/Creator Petrash, Stanislas

1. Unraveling the Mechanism of Electrically Induced Adhesive Debonding: A Spectro‐Microscopic Study. Issue 1 (2nd December 2021)

Authors:
Anduix‐Canto, Clara; Peral, Daniel; Pérez‐Padilla, Víctor; Diaz‐Rovira, Anna Maria; Belmez Lledó, Alejandro; Orme, Christine A.; Petrash, Stanislas; Engels, Thomas; Chou, Kang Wei
Journal:
Advanced materials interfaces
Issue:
Volume 9:Issue 1(2022)
Page Start:
n/a
Record Type:
Journal Article
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2. Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography. Issue 4 (19th February 2020)

Authors:
Lin, Yu-Chung; Liu, Xiaoyang; Chou, Kang Wei; Tsai, Esther H. R.; Zhao, Chonghang; Holler, Mirko; Diaz, Ana; Petrash, Stanislas; Chen-Wiegart, Yu-chen Karen
Journal:
Advanced engineering materials
Issue:
Volume 22:Issue 4(2020)
Page Start:
n/a
Record Type:
Journal Article
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3. Use of Full-Field X- ray Imaging and Ptychographic X-ray Computed Tomography for the Investigation of 3D Morphology of Micro-Nano Silver Materials for Advanced Electronics Packaging Applications. (August 2021)

Authors:
Lin, Yu-Chung; Liu, Xiaoyang; Chou, Kang-wei; Tsai, Esther H. R.; Zhao, Chonghang; Holler, Mirko; Diaz, Ana; Petrash, Stanislas; Chen-Wiegart, Yu-chen Karen; Lee, Wah-Keat
Journal:
Microscopy and microanalysis
Issue:
Volume 27:Supplement 1(2021)
Page Start:
1026
Record Type:
Journal Article
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