1. A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads. Issue 3 (2014) Authors: Jonas Johansson; Ilja Belov; Erland Johnson; Peter Leisner Journal: Engineering computations Issue: Volume 31:Issue 3(2014) Page Start: 467 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗