1. Computational analysis and experimental evidence of two typical levelers for acid copper electroplating. (20th May 2018) Authors: Lai, Zhiqiang; Wang, Shouxu; Wang, Chong; Hong, Yan; Chen, Yuanming; Zhang, Huaiwu; Zhou, Guoyun; He, Wei; Ai, Kehua; Peng, Yongqiang Journal: Electrochimica acta Issue: Volume 273(2018) Page Start: 318 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution. Issue 14 (1st January 2017) Authors: Tao, Zhihua.; He, Wei.; Li, Jing; Wang, Shouxu; Chen, Yuanming; Ai, Kehua; Peng, Yongqiang; Hong, Yan Journal: Journal of the Electrochemical Society Issue: Volume 164:Issue 14(2017) Page Start: D1034 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution. Issue 14 (28th December 2017) Authors: Tao, Zhihua.; He, Wei.; Li, Jing; Wang, Shouxu; Chen, Yuanming; Ai, Kehua; Peng, Yongqiang; Hong, Yan Journal: Journal of the Electrochemical Society Issue: Volume 164:Issue 14(2017) Page Start: D1034 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗