Author/Creator: Osterman, Michael - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Osterman, Michael

1. An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model. Issue 3 (February 2015)

Authors:: George, Elviz; Osterman, Michael; Pecht, Michael
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 3/4(2015)
Page Start:: 582
Record Type:: Journal Article
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2. Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life. (June 2020)

Authors:: Chen, Deng Yun; Osterman, Michael; Dasgupta, Abhijit
Journal:: Microelectronics and reliability
Issue:: Volume 109(2020)
Page Start:
Record Type:: Journal Article
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3. Life cycle trends of electronic materials, processes and components. (August 2019)

Authors:: Huang, Chien-Ming; Romero, Jose A.; Osterman, Michael; Das, Diganta; Pecht, Michael
Journal:: Microelectronics and reliability
Issue:: Volume 99(2019)
Page Start:: 262
Record Type:: Journal Article
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