1. 57‐3: MircoLED Display Integration on 300mm Advanced CMOS Platform. Issue 1 (28th June 2022) Authors: Steudel, Soeren; Vertommen, Johan; Le Boulbar, Emmanuel; Buscemi, Giuseppe; Bach, Lars; Van Huylenbroeck, Stefaan; Arumugam, Hariharan; La Tulipe, Douglas Charles; De Vos, Joeri; Miller, Andy; Osman, Haris; Rebibis, Kenneth June Journal: Digest of technical papers Issue: Volume 53:Issue 1(2022) Page Start: 748 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization. (23rd August 2016) Authors: Cavaco, Celso; Peng, Lan; Lavizzari, Simone; Claes, Jesse; Hoovels, Nele V.; Guerrieri, Stefano; Tezcan, Deniz Sabuncuoglu; Osman, Haris Journal: ECS transactions Issue: Volume 75:Number 7(2016) Page Start: 43 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes. (7th April 2015) Authors: Cavaco, Celso; Peng, Lan; Sebaai, Farid; Verbinnen, Greet; Visker, Jakob; Olmen, Jan; Tezcan, Deniz Sabuncuoglu; Osman, Haris Journal: ECS transactions Issue: Volume 64:Number 40(2014) Page Start: 123 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗