1. Advanced 3D failure characterization in multi-layered PCBs. (December 2016) Authors: Grünwald, E.; Hammer, R.; Rosc, J.; Maier, G.A.; Bärnthaler, M.; Cordill, M.J.; Brand, S.; Nuster, R.; Krivec, T.; Brunner, R. Journal: NDT & E international Issue: Volume 84(2016) Page Start: 99 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Advanced 3D failure characterization in multi-layered PCBs. (December 2016) Authors: Grünwald, E.; Hammer, R.; Rosc, J.; Maier, G.A.; Bärnthaler, M.; Cordill, M.J.; Brand, S.; Nuster, R.; Krivec, T.; Brunner, R. Journal: NDT & E international Issue: Volume 84(2016) Page Start: 99 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗