Author/Creator: Ngo, Khai D.T. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Ngo, Khai D.T.

1. A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line. Issue 8 (18th March 2014)

Authors:: Xiao, Kewei; Ngo, Khai D.T.; Lu, Guo-Quan
Journal:: Journal of materials research
Issue:: Volume 29:Issue 8(2014)
Page Start:: 1006
Record Type:: Journal Article
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2. A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line. Issue 8 (18th March 2014)

Authors:: Xiao, Kewei; Ngo, Khai D.T.; Lu, Guo-Quan
Journal:: Journal of materials research
Issue:: Volume 29:Issue 8(2014)
Page Start:: 1006
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

3. Effects of SiO2 inclusions on sintering and permeability of NiCuZn ferrite for additive manufacturing of power magnets. Issue 1 (January 2021)

Authors:: Liu, Lanbing; Ngo, Khai D.T.; Lu, Guo-Quan
Journal:: Journal of the European Ceramic Society
Issue:: Volume 41:Issue 1(2021)
Page Start:: 466
Record Type:: Journal Article
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4. Guideline for paste extrusion 3D printing of slump-free ferrite inductor cores. Issue 4 (15th February 2021)

Authors:: Liu, Lanbing; Ngo, Khai D.T.; Lu, Guo-Quan
Journal:: Ceramics international
Issue:: Volume 47:Issue 4(2021)
Page Start:: 5803
Record Type:: Journal Article
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5. Multi‐megahertz quasi‐square‐wave flyback converter using eGaN FETs. Issue 10 (14th June 2017)

Authors:: Zhang, Zhemin; Ngo, Khai D.T.
Journal:: IET power electronics
Issue:: Volume 10:Issue 10(2017)
Page Start:: 1138
Record Type:: Journal Article
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6. Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection. (August 2016)

Authors:: Berry, David; Townsend, Adrian; He, Weikun; Zheng, Hanguang; Ngo, Khai D.T.; Lu, Guo-Quan
Journal:: Microelectronics and reliability
Issue:: Volume 63(2016)
Page Start:: 104
Record Type:: Journal Article
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7. Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection. (August 2016)

Authors:: Berry, David; Townsend, Adrian; He, Weikun; Zheng, Hanguang; Ngo, Khai D.T.; Lu, Guo-Quan
Journal:: Microelectronics and reliability
Issue:: Volume 63(2016)
Page Start:: 104
Record Type:: Journal Article
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8. Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules. Issue 12 (December 2015)

Authors:: Zheng, Hanguang; Ngo, Khai D.T.; Lu, Guo-Quan
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 12 Part A(2015)
Page Start:: 2575
Record Type:: Journal Article
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