1. Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding. (8th September 2020) Authors: Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric Journal: ECS transactions Issue: Volume 98:Number 4(2020) Page Start: 21 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗