Author/Creator: Muhammad, Riaz / Journal: Microelectronics and reliability - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Muhammad, Riaz Journal Microelectronics and reliability

1. Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics. (November 2017)

Authors:: Aamir, Muhammad; Muhammad, Riaz; Ahmed, Naseer; Waqas, Muhammad
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 311
Record Type:: Journal Article
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