1. A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics. Issue 2 (14th October 2019) Authors: Aamir, Muhammad; Muhammad, Riaz; Tolouei-Rad, Majid; Giasin, Khaled; Silberschmidt, Vadim V. Journal: Soldering & surface mount technology Issue: Volume 32:Issue 2(2020) Page Start: 115 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics. Issue 2 (17th October 2019) Authors: Aamir, Muhammad; Muhammad, Riaz; Tolouei-Rad, Majid; Giasin, Khaled; Silberschmidt, Vadim V. Journal: Soldering & surface mount technology Issue: Volume 32:Issue 2(2020) Page Start: 115 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗