Author/Creator: Mokhtari, Omid - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Mokhtari, Omid

1. A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions. (July 2019)

Authors:: Mokhtari, Omid
Journal:: Microelectronics and reliability
Issue:: Volume 98(2019)
Page Start:: 95
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

2. Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor. (17th June 2019)

Authors:: Mokhtari, Omid; Conti, Fosca; Bhogaraju, Sri Krishna; Meier, Markus; Schweigart, Helmut; Tetzlaff, Ulrich; Elger, Gordon
Journal:: New journal of chemistry
Issue:: Volume 43:Number 26(2019)
Page Start:: 10227
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

3. Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol. (June 2020)

Authors:: Bhogaraju, Sri Krishna; Mokhtari, Omid; Conti, Fosca; Elger, Gordon
Journal:: Scripta materialia
Issue:: Number 182(2020)
Page Start:: 74
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

4. Effect of surface potential distribution on corrosion behavior of Cu/Al interface in Cu wire bonding applications. (October 2020)

Authors:: Mokhtari, Omid; Nishikawa, Hiroshi
Journal:: Microelectronics and reliability
Issue:: Volume 113(2020)
Page Start:
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

5. Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor. (7th November 2018)

Authors:: Conti, Fosca; Hanss, Alexander; Mokhtari, Omid; Bhogaraju, Sri Krishna; Elger, Gordon
Journal:: New journal of chemistry
Issue:: Volume 42:Number 23(2018)
Page Start:: 19232
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

6. Formic acid and formate salts for chemical vapor deposition of copper on glass substrates at atmospheric pressure. (28th September 2021)

Authors:: Mokhtari, Omid; Conti, Fosca; Saccon, Rodolfo; Bhogaraju, Sri Krishna; Elger, Gordon
Journal:: New journal of chemistry
Issue:: Volume 45:Number 43(2021)
Page Start:: 20133
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗