Author/Creator: Mayappan, Ramani - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Mayappan, Ramani

1. Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder. Issue 2 (1st November 2019)

Authors:: Mayappan, Ramani; Salleh, Amirah; Tokiran, Nurul Atiqah; Awang, N.A.
Journal:: Soldering & surface mount technology
Issue:: Volume 32:Issue 2(2020)
Page Start:: 65
Record Type:: Journal Article
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2. Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder. Issue 2 (6th November 2019)

Authors:: Mayappan, Ramani; Salleh, Amirah; Tokiran, Nurul Atiqah; Awang, N.A.
Journal:: Soldering & surface mount technology
Issue:: Volume 32:Issue 2(2020)
Page Start:: 65
Record Type:: Journal Article
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3. Improvement in Intermetallic Thickness and Joint Strength in Carbon Nanotube Composite Sn-3.5Ag Lead-free Solder. (2016)

Authors:: Mayappan, Ramani; Hassan, Anis Afiqah; Ab Ghani, Noor Asikin; Yahya, Iziana; Andas, Jeyashelly
Journal:: Materials today
Issue:: Volume 3:Number 6(2016)
Page Start:: 1338
Record Type:: Journal Article
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4. Silver effect on the intermetallic growth in the Sn-8Zn-3Bi lead-free solder. (2018)

Authors:: Mayappan, Ramani; Aishah Jasli, Nor
Journal:: Materials today
Issue:: Volume 5:Number 9(2018)Part 3
Page Start:: 17553
Record Type:: Journal Article
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