1. Aluminum metallization and wire bonding aging in power MOSFET modules. (2018) Authors: Ruffilli, R.; Berkani, M.; Dupuy, P.; Lefebvre, S.; Weber, Y.; Warot-Fonrose, B.; Marcelot, C.; Legros, M. Journal: Materials today Issue: Volume 5:Number 6(2018)Part 3 Page Start: 14641 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗