1. Wafer level hermetic bonding and packaging using recrystallized parylene. (1st January 2023) Authors: Maharshi, Vikram; Ahmad, Imran; Agarwal, Ajay; Mitra, Bhaskar Journal: Journal of micromechanics and microengineering Issue: Volume 33:Number 1(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗