1. Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC. Issue 3 (5th June 2017) Authors: Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan Journal: Soldering & surface mount technology Issue: Volume 29:Issue 3(2017) Page Start: 151 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗