Author/Creator: Liu, Allan - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Liu, Allan

1. Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding. (November 2022)

Authors:: Liang, Shuibao; Zhong, Yi; Robertson, Stuart; Liu, Allan; Jiang, Han; Liu, Canyu; Zhou, Zhaoxia; Liu, Changqing
Journal:: Microelectronics and reliability
Issue:: Volume 138(2022)
Page Start:
Record Type:: Journal Article
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2. Investigation of wear mechanics and behaviour of NiCr metallic foam abradables. (May 2022)

Authors:: Liu, Allan; Marshall, Matthew; Rahimov, Eldar; Panizo, Julian
Journal:: Proceedings of the Institution of Mechanical Engineers
Issue:: Volume 236:Number 9(2022)
Page Start:: 4962
Record Type:: Journal Article
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3. Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging. (November 2021)

Authors:: Liu, Canyu; Liu, Allan; Su, Yutai; Zhou, Zhaoxia; Liu, Changqing
Journal:: Microelectronics and reliability
Issue:: Volume 126(2021)
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Record Type:: Journal Article
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4. Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging. (November 2022)

Authors:: Liu, Canyu; Liu, Allan; Jiang, Han; Liang, Shuibao; Zhou, Zhaoxia; Liu, Changqing
Journal:: Microelectronics and reliability
Issue:: Volume 138(2022)
Page Start:
Record Type:: Journal Article
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5. Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects. (January 2022)

Authors:: Liu, Canyu; Liu, Allan; Su, Yutai; Chen, Yi; Zhou, Zhaoxia; Liu, Changqing
Journal:: Journal of manufacturing processes
Issue:: Volume 73(2022)
Page Start:: 139
Record Type:: Journal Article
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