1. A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property. (November 2020) Authors: Liao, Yi-Han; Chen, Chang-Hsien; Liang, Chien-Lung; Lin, Kwang-Lung; Wu, Albert T. Journal: Acta materialia Issue: Volume 200(2020) Page Start: 200 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps. (June 2017) Authors: Chen, Chiao-Wen; Chiu, Tsung-Chieh; Chiu, Ying-Ta; Lee, Chiu-Wen; Lin, Kwang-Lung Journal: Intermetallics Issue: Volume 85(2017) Page Start: 117 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study. Issue 3 (13th March 2018) Authors: Mittal, Jagjiwan; Lin, Kwang-Lung Journal: Soldering & surface mount technology Issue: Volume 30:Issue 3(2018) Page Start: 137 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study. Issue 3 (4th June 2018) Authors: Mittal, Jagjiwan; Lin, Kwang-Lung Journal: Soldering & surface mount technology Issue: Volume 30:Issue 3(2018) Page Start: 137 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu. (May 2021) Authors: Lin, Ting-Chun; Liang, Chien-Lung; Wang, Shan-Bo; Lin, Yung-Sheng; Kao, Chin-Li; Tarng, David; Lin, Kwang-Lung Journal: Scripta materialia Issue: Number 197(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Non-epitaxial silver nanodendrite growth via helical nano-yarn bundling at intra-dendrite interface under applied bias. (15th April 2022) Authors: Tsai, Wen-Chieh; Liang, Chien-Lung; Lin, Kwang-Lung Journal: Scripta materialia Issue: Number 212(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Softening of Micro Sn Electrodeposit by Polyethylene Glycol (PEG) Addition. (1st January 2018) Authors: Chiu, Tsung-Chieh; Chiu, Ying-Ta; Lin, Kwang-Lung Journal: ECS journal of solid state science and technology Issue: Volume 7:Number 3(2018) Page Start: P109 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Softening of Micro Sn Electrodeposit by Polyethylene Glycol (PEG) Addition. (22nd February 2018) Authors: Chiu, Tsung-Chieh; Chiu, Ying-Ta; Lin, Kwang-Lung Journal: ECS journal of solid state science and technology Issue: Volume 7:Number 3(2018) Page Start: P109 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration. (October 2018) Authors: Liang, Chien-Lung; Lin, Kwang-Lung Journal: Scripta materialia Issue: Number 155(2018) Page Start: 58 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗