1. ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects. (10th September 2015) Authors: Nag, Joyeeta; Cohen, Brian; Choi, Samuel; Ogino, Atsushi; Oh, Minseok; Yan, Yan; Liang, Jim; Christiansen, Cathryn; Kim, Andrew; Li, Baozhen; DeHaven, Patrick; Madan, Anita; Krishnan, Siddarth; Simon, Andrew H Journal: ECS transactions Issue: Volume 69:Number 7(2015) Page Start: 161 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗