1. Co-deposition of C and NiP to fabricate high-ohmic resistor for board-level integration with on-line monitoring method. (March 2023) Authors: Zhou, Guoyun; Luo, Yuxing; Hong, Yan; He, Wei; Wang, Shouxu; Chen, Yuanming; Wang, Chong; Tang, Yao; Sun, Yukai; Zhu, Yongkang; Li, Jiujuan Journal: Microelectronics and reliability Issue: Volume 142(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles. (1st December 2018) Authors: Li, Jiujuan; Zhou, Guoyun; Jin, Xiaofeng; Hong, Yan; He, Wei; Wang, Shouxu; Chen, Yuanming; Yang, Wenjun; Su, Xinhong Journal: Composites Issue: Number 154(2018) Page Start: 257 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate. (10th January 2020) Authors: Li, Jiujuan; Zhou, Guoyun; Hong, Yan; He, Wei; Wang, Shouxu; Wang, Chong; Chen, Yuanming; Zhou, Jinqun; Miao, Hua; Weng, Zesheng; Andersson, Martin Journal: Electrochimica acta Issue: Volume 330(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗