1. A versatile low-resistance ohmic contact process with ohmic recess and low-temperature annealing for GaN HEMTs. (21st August 2018) Authors: Lin, Yen-Ku; Bergsten, Johan; Leong, Hector; Malmros, Anna; Chen, Jr-Tai; Chen, Ding-Yuan; Kordina, Olof; Zirath, Herbert; Chang, Edward Yi; Rorsman, Niklas Journal: Semiconductor science and technology Issue: Volume 33:Number 9(2018:Sep.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. New sustainable ternary copper phosphide thermoelectrics. Issue 84 (3rd October 2022) Authors: Quinn, Robert J.; Stevens, Callum; Leong, Hector; Huxley, Andrew D.; Bos, Jan-Willem G. Journal: Chemical communications Issue: Volume 58:Issue 84(2022) Page Start: 11811 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗