Author/Creator: Krivec, T. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Krivec, T.

1. Advanced 3D failure characterization in multi-layered PCBs. (December 2016)

Authors:: Grünwald, E.; Hammer, R.; Rosc, J.; Maier, G.A.; Bärnthaler, M.; Cordill, M.J.; Brand, S.; Nuster, R.; Krivec, T.; Brunner, R.
Journal:: NDT & E international
Issue:: Volume 84(2016)
Page Start:: 99
Record Type:: Journal Article
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2. Advanced 3D failure characterization in multi-layered PCBs. (December 2016)

Authors:: Grünwald, E.; Hammer, R.; Rosc, J.; Maier, G.A.; Bärnthaler, M.; Cordill, M.J.; Brand, S.; Nuster, R.; Krivec, T.; Brunner, R.
Journal:: NDT & E international
Issue:: Volume 84(2016)
Page Start:: 99
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

3. Method development for the cyclic characterization of thin copper layers for PCB applications. Issue 2 (29th April 2014)

Authors:: Fellner, K.; Fuchs, P.F.; Pinter, G.; Antretter, T.; Krivec, T.
Journal:: Circuit world
Issue:: Volume 40:Issue 2(2014)
Page Start:: 53
Record Type:: Journal Article
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4. Method development for the cyclic characterization of thin copper layers for PCB applications. Issue 2 (29th April 2014)

Authors:: Fellner, K.; Fuchs, P.F.; Pinter, G.; Antretter, T.; Krivec, T.
Journal:: Circuit world
Issue:: Volume 40:Issue 2(2014)
Page Start:: 53
Record Type:: Journal Article
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5. Stress and Deflection Development During Die Embedding into Printed Circuit Boards. (2015)

Authors:: Macurova, K.; Angerer, P.; Bermejo, R.; Pletz, M.; Schöngrundner, R.; Antretter, T.; Krivec, T.; Morianz, M.; Brizoux, M.; Lecavelier, A.
Journal:: Materials today
Issue:: Volume 2:Number 8(2015)
Page Start:: 4196
Record Type:: Journal Article
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