Search

Search Constraints

You searched for: Author/Creator Khanna, Aniruddh J.

Search Results

1. Engineering Surface Texture of Pads for Improving CMP Performance of Sub-10 nm Nodes. (12th October 2020)

2. High-Performance Pad Conditioning (HPPC) Arm for Augmenting CMP Performance. (3rd August 2020)

3. Impact of Pad Material Properties on CMP Performance for Sub-10nm Technologies. (1st January 2019)

4. Impact of Pad Material Properties on CMP Performance for Sub-10nm Technologies. (28th February 2019)

5. Investigation of the Impact of Pad Surface Texture from Different Pad Conditioners on the CMP Performance. (3rd August 2020)