1. A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints. (November 2022) Authors: Ismail, N.; Atiqah, A.; Jalar, A.; Bakar, M.A.; Rahim, R.A.A.; Ismail, A.G.; Hamzah, A.A.; Keng, L.K. Journal: Journal of manufacturing processes Issue: Volume 83(2022) Page Start: 68 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗