1. Highly uniform microfluidic electroless interconnections for chip stacking applications. (20th April 2021) Authors: Hung, H.T.; Ma, Z.D.; Shih, P.S.; Huang, J.H.; Kao, L.Y.; Yang, C.Y.; Renganathan, Vengudusamy; Kao, C.L.; Hung, Y.C.; Kao, C.R. Journal: Electrochimica acta Issue: Volume 376(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗