1. An experimental investigation of shear strength and adhesion on the chip-substrate joint in LED packaging. (December 2022) Authors: Alim, Md. Abdul; Abdul Aziz, Mohd Sharizal; Abdullah, M.Z.; Kamarudin, R.; Lee, J.R.; Rusdi, M.S.; Khor, C.Y. Journal: International journal of adhesion & adhesives Issue: Volume 119(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Analysis of LED wire bonding during encapsulation process. Issue 1 (December 2020) Authors: Roslan, Hafiz; Abdul Aziz, M.S.; Abdullah, M.Z.; Kamarudin, R.; Ishak, M.H.H.; Ismail, F.; Purna Irawan, Agustinus Journal: IOP conference series Issue: Volume 1007:Issue 1(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Experimental study on luminous intensity of white LEDs of different configurations. Issue 1 (December 2020) Authors: Abdul Alim, Md; Abdullah, M. Z.; Abdul Aziz, M.S.; Kamarudin, R.; Purna Irawan, Agustinus; Siahaan, E. Journal: IOP conference series Issue: Volume 1007:Issue 1(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗