1. System in package (SiP) technology: fundamentals, design and applications. Issue 4 (1st October 2018) Authors: Santagata, Fabio; Sun, Jianwen; Iervolino, Elina; Yu, Hongyu; Wang, Fei; Zhang, Guoqi; Sarro, P.M.; Zhang, Guoyi Journal: Microelectronics international Issue: Volume 35:Issue 4(2018) Page Start: 231 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗