1. Development of a novel plasma scanning technique for high-quality anodic bonding. (29th February 2016) Authors: Wu, Jim-Wei; Yang, Chii-Rong; Huang, Che-Yi Journal: Journal of micromechanics and microengineering Issue: Volume 26:Number 4(2016:Apr.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗