1. Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration. (22nd May 2019) Authors: Cai, Han; Yan, Jun; Ma, Shenglin; Luo, Rongfeng; Xia, Yanming; Li, Jiwei; Hu, Liulin; He, Shuwei; Tang, Zhongjun; Jin, Yufeng; Wang, Wei; Chen, Jing Journal: Journal of micromechanics and microengineering Issue: Volume 29:Number 7(2019:Jul.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗