Author/Creator: Hsieh, Chi-Lung - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Hsieh, Chi-Lung

1. A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging. (November 2017)

Authors:: Kung, Huang-Kuang; Hsieh, Chi-Lung
Journal:: Microelectronics and reliability
Issue:: Volume 78(2017)
Page Start:: 272
Record Type:: Journal Article
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