1. A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test. (1st February 2023) Authors: Zhou, Ping; Shi, Haosong; Wang, Lin; Hou, Changyu; Meng, Lei; Di, Hongyu; Guo, Dongming Journal: International journal of mechanical sciences Issue: Volume 239(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Micro-scale contact behavior and its effect on the material removal process during chemical mechanical polishing. (April 2021) Authors: Wang, Lin; Zhou, Ping; Yan, Ying; Hou, Changyu; Guo, Dongming Journal: Tribology international Issue: Volume 156(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗