1. Solid-liquid interdiffusion (SLID) bonding in the Au–In system: experimental study and 1D modelling. (3rd November 2015) Authors: Deillon, Léa; Hessler-Wyser, Aïcha; Hessler, Thierry; Rappaz, Michel Journal: Journal of micromechanics and microengineering Issue: Volume 25:Number 12(2015:Dec.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗