1. Temperature increase in STT-MRAM at writing: A fully three-dimensional finite element approach. (July 2022) Authors: Hadámek, T.; Fiorentini, S.; Bendra, M.; Ender, J.; de Orio, R.L.; Goes, W.; Selberherr, S.; Sverdlov, V. Journal: Solid-state electronics Issue: Volume 193(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗