1. Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization. (23rd August 2016) Authors: Cavaco, Celso; Peng, Lan; Lavizzari, Simone; Claes, Jesse; Hoovels, Nele V.; Guerrieri, Stefano; Tezcan, Deniz Sabuncuoglu; Osman, Haris Journal: ECS transactions Issue: Volume 75:Number 7(2016) Page Start: 43 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗