1. Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations. (September 2017) Authors: Pin, S.; Frémont, H.; Guédon-Gracia, A. Journal: Microelectronics and reliability Issue: Volume 76/77(2017) Page Start: 368 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Creep measurement and choice of creep laws for BGA assemblies' reliability simulation. (September 2018) Authors: Pin, S.; Guédon-Gracia, A.; Delétage, J.-Y.; Frémont, H. Journal: Microelectronics and reliability Issue: Volume 88/90(2018) Page Start: 1172 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Effects of salt spray test on lead-free solder alloy. (September 2016) Authors: Guédon-Gracia, A.; Frémont, H.; Plano, B.; Delétage, J.-Y.; Weide-Zaage, K. Journal: Microelectronics and reliability Issue: Volume 64(2016) Page Start: 242 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Effects of salt spray test on lead-free solder alloy. (September 2016) Authors: Guédon-Gracia, A.; Frémont, H.; Plano, B.; Delétage, J.-Y.; Weide-Zaage, K. Journal: Microelectronics and reliability Issue: Volume 64(2016) Page Start: 242 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue. (November 2021) Authors: Ben Romdhane, E.; Roumanille, P.; Guédon-Gracia, A.; Pin, S.; Nguyen, P.; Frémont, H. Journal: Microelectronics and reliability Issue: Volume 126(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components. (November 2020) Authors: Ben Romdhane, E.; Guédon-Gracia, A.; Pin, S.; Roumanille, P.; Frémont, H. Journal: Microelectronics and reliability Issue: Volume 114(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Impact of temperature on the corrosion of lead-free solder alloy during salt spray test. (November 2021) Authors: Akoda, K.E.; Guédon-Gracia, A.; Delétage, J.-Y.; Plano, B.; Frémont, H. Journal: Microelectronics and reliability Issue: Volume 126(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering. (September 2017) Authors: Barrière, M.; Guédon-Gracia, A.; Woirgard, E.; Bontemps, S.; Le Henaff, F. Journal: Microelectronics and reliability Issue: Volume 76/77(2017) Page Start: 431 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗