Author/Creator: Gonzaga, Jeremias A. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Gonzaga, Jeremias A.

1. Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading. (October 2020)

Authors:: Lim, Niño Rigo Emil G.; Ubando, Aristotle T.; Gonzaga, Jeremias A.; Dimagiba, Richard Raymond N.
Journal:: Engineering failure analysis
Issue:: Volume 116(2020)
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Record Type:: Journal Article
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2. Wafer-level chip-scale package lead-free solder fatigue: A critical review. (February 2023)

Authors:: Arriola, Emmanuel R.; Ubando, Aristotle T.; Gonzaga, Jeremias A.; Lee, Chang-Chun
Journal:: Engineering failure analysis
Issue:: Volume 144(2023)
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Record Type:: Journal Article
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