1. Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants: a comparative long-term ageing study. (6th April 2021) Authors: Lamont, C; Grego, T; Nanbakhsh, K; Shah Idil, A; Giagka, V; Vanhoestenberghe, A; Cogan, S; Donaldson, N Journal: Journal of neural engineering Issue: Volume 18:Number 5(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗