1. An improved unit circuit model for transient heat conduction performance analysis and optimization in multi-layer materials. (25th January 2018) Authors: He, Ke-Lun; Chen, Qun; Dong, En-fu; Ge, Wei-Chun; Hao, Jun-Hong; Xu, Fei Journal: Applied thermal engineering Issue: Volume 129(2018) Page Start: 1551 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗