1. Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL). (1st January 2023) Authors: Huang, Jing; Gao, Li-Yin; Peng, Zhen-Jia; Li, Zhe; Liu, Zhi-Quan; Sun, Rong Journal: Nanotechnology Issue: Volume 34:Number 1(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate. Issue 10 (October 2018) Authors: Sun, Fu-Long; Gao, Li-Yin; Liu, Zhi-Quan; Zhang, Hao; Sugahara, Tohru; Nagao, Shijo; Suganuma, Katsuaki Journal: Journal of materials science & technology Issue: Volume 34:Issue 10(2018) Page Start: 1885 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package. Issue 8 (August 2018) Authors: Gao, Li-Yin; Zhang, Hao; Li, Cai-Fu; Guo, Jingdong; Liu, Zhi-Quan Journal: Journal of materials science & technology Issue: Volume 34:Issue 8(2018) Page Start: 1305 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. The effect of finish layer on the interfacial cracking failure of AuSi bonding. (September 2020) Authors: Gao, Li-Yin; Wen, Jian; Li, Cai-Fu; Chen, Chunhuan; Liu, Zhi-Quan Journal: Engineering failure analysis Issue: Volume 115(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗