1. Mechanical strength problem of thin silicon wafers (120 and 140 μm) cut with thinner diamond wires (Si kerf 120 → 100 μm) for photovoltaic use. (15th November 2020) Authors: Sekhar, Halubai; Fukuda, Tetsuo; Tanahashi, Katsuto; Takato, Hidetaka; Ono, Hiromichi; Sampei, Yoshiyuki; Kobayashi, Tsubasa Journal: Materials science in semiconductor processing Issue: Volume 119(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Quality of n-Type Czochralski Silicon Crystals for Solar Cells Grown from the Melt in Liquinert Crucibles. (1st January 2018) Authors: Fukuda, Tetsuo; Horioka, Yukichi; Kariya, Nobumasa; Tanahashi, Katsuto; Takato, Hidetaka Journal: ECS journal of solid state science and technology Issue: Volume 7:Number 10(2018) Page Start: P562 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Quality of n-Type Czochralski Silicon Crystals for Solar Cells Grown from the Melt in Liquinert Crucibles. (5th October 2018) Authors: Fukuda, Tetsuo; Horioka, Yukichi; Kariya, Nobumasa; Tanahashi, Katsuto; Takato, Hidetaka Journal: ECS journal of solid state science and technology Issue: Volume 7:Number 10(2018) Page Start: P562 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. The impact of damage etching on fracture strength of diamond wire sawn monocrystalline silicon wafers for photovoltaics use. (2nd November 2018) Authors: Sekhar, Halubai; Fukuda, Tetsuo; Kida, Yasuhiro; Tanahashi, Katsuto; Takato, Hidetaka Journal: Japanese journal of applied physics Issue: Volume 57:Number 12(2018) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. The impact of saw mark direction on the fracture strength of thin (120 µm) monocrystalline silicon wafers for photovoltaic cells. (30th July 2018) Authors: Sekhar, Halubai; Fukuda, Tetsuo; Tanahashi, Katsuto; Shirasawa, Katsuhiko; Takato, Hidetaka; Ohkubo, Kazuya; Ono, Hiromichi; Sampei, Yoshiyuki; Kobayashi, Tsubasa Journal: Japanese journal of applied physics Issue: Volume 57:Number 9(2018) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. The impact of silicon brick polishing on thin (120 μm) silicon wafer sawing yields and fracture strengths in diamond-wire sawing. (January 2020) Authors: Sekhar, Halubai; Fukuda, Tetsuo; Tanahashi, Katsuto; Takato, Hidetaka Journal: Materials science in semiconductor processing Issue: Volume 105(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗