1. Method development for the cyclic characterization of thin copper layers for PCB applications. Issue 2 (29th April 2014) Authors: Fellner, K.; Fuchs, P.F.; Pinter, G.; Antretter, T.; Krivec, T. Journal: Circuit world Issue: Volume 40:Issue 2(2014) Page Start: 53 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Method development for the cyclic characterization of thin copper layers for PCB applications. Issue 2 (29th April 2014) Authors: Fellner, K.; Fuchs, P.F.; Pinter, G.; Antretter, T.; Krivec, T. Journal: Circuit world Issue: Volume 40:Issue 2(2014) Page Start: 53 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗