1. Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications. (September 2016) Authors: Zhang, Yong; Edwards, Michael; Samani, Majid Kabiri; Logothetis, Nikolaos; Ye, Lilei; Fu, Yifeng; Jeppson, Kjell; Liu, Johan Journal: Carbon Issue: Volume 106(2016) Page Start: 195 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications. (September 2016) Authors: Zhang, Yong; Edwards, Michael; Samani, Majid Kabiri; Logothetis, Nikolaos; Ye, Lilei; Fu, Yifeng; Jeppson, Kjell; Liu, Johan Journal: Carbon Issue: Volume 106(2016) Page Start: 195 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Embedded Fin‐Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors. Issue 11 (14th January 2016) Authors: Jiang, Di; Wang, Nan; Edwards, Michael; Mu, Wei; Nylander, Andreas; Fu, Yifeng; Jeppson, Kjell; Liu, Johan Journal: Small Issue: Volume 12:Issue 11(2016) Page Start: 1521 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Graphene oxide based coatings on nitinol for biomedical implant applications: effectively promote mammalian cell growth but kill bacteria. Issue 44 (18th April 2016) Authors: Zhao, Changhong; Pandit, Santosh; Fu, Yifeng; Mijakovic, Ivan; Jesorka, Aldo; Liu, Johan Journal: RSC advances Issue: Volume 6:Issue 44(2016) Page Start: 38124 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging. (January 2016) Authors: Sun, Shuangxi; Chen, Si; Luo, Xin; Fu, Yifeng; Ye, Lilei; Liu, Johan Journal: Microelectronics and reliability Issue: Volume 56(2016) Page Start: 129 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging. (January 2016) Authors: Sun, Shuangxi; Chen, Si; Luo, Xin; Fu, Yifeng; Ye, Lilei; Liu, Johan Journal: Microelectronics and reliability Issue: Volume 56(2016) Page Start: 129 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging. (26th May 2016) Authors: Bao, Jie; Edwards, Michael; Huang, Shirong; Zhang, Yong; Fu, Yifeng; Lu, Xiuzhen; Yuan, Zhichao; Jeppson, Kjell; Liu, Johan Journal: Journal of physics Issue: Volume 49:Number 26(2016) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects. (8th July 2016) Authors: Sun, Shuangxi; Mu, Wei; Edwards, Michael; Mencarelli, Davide; Pierantoni, Luca; Fu, Yifeng; Jeppson, Kjell; Liu, Johan Journal: Nanotechnology Issue: Volume 27:Number 33(2016) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗